: Guangdong Taijin Semiconductor Technology Co., Ltd

A manufacturer for semiconductor package equipment include Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold

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Semiconductor Production MGP Mould Tool SOP Series Corrosion Resistance

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Semiconductor Molding Machine [25]
Trim And Form Machine [25]
IC Lead Frame Stamping Mold [19]
MGP Mold [30]
Trimming Forming Dies [25]
Mold Chase [6]
Semiconductor Molding Equipment [25]
Chip Sorting Machine [25]

Guangdong Taijin Semiconductor Technology Co., Ltd

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City: Dongguan

Province/State: Guangdong

Country/Region: China

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Semiconductor Production MGP Mould Tool SOP Series Corrosion Resistance

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Semiconductor Production MGP Mould Tool SOP Series Corrosion Resistance

SOP Series MGP Mold Features: Product Name: MGP Mold Design Software: UG, ProE, Solidworks, AutoCAD Gate Type: Edge Gate, Pin Point Gate, Sub Gate, Fan Gate, Etc. Cavity: Single Or Multi Mold Base: ...

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Semiconductor Production MGP Mould

Semiconductor Production mould tool

mould tool Corrosion Resistance

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